Homogenization analysis of electronic packaging based on a high order layer-discrete model

doi:10.6052/0459-1879-2005-4-2004-047

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中文核心期刊

Homogenization analysis of electronic packaging based on a high order layer-discrete model[J]. Chinese Journal of Theoretical and Applied Mechanics, 2005, 37(4): 428-434. DOI: 10.6052/0459-1879-2005-4-2004-047

Citation:

Homogenization analysis of electronic packaging based on a high order layer-discrete model[J]. Chinese Journal of Theoretical and Applied Mechanics, 2005, 37(4): 428-434. DOI: 10.6052/0459-1879-2005-4-2004-047

Citation:

Homogenization analysis of electronic packaging based on a high order layer-discrete model[J]. Chinese Journal of Theoretical and Applied Mechanics, 2005, 37(4): 428-434. DOI: 10.6052/0459-1879-2005-4-2004-047