STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY

doi:10.6052/0459-1879-1997-4-1995-250

Article Contents

Article Navigation > Chinese Journal of Theoretical and Applied Mechanics > 1997 > 29(4): 448-455

STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY[J]. Chinese Journal of Theoretical and Applied Mechanics, 1997, 29(4): 448-455. doi: 10.6052/0459-1879-1997-4-1995-250

Citation:

STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY[J]. Chinese Journal of Theoretical and Applied Mechanics, 1997, 29(4): 448-455. doi: 10.6052/0459-1879-1997-4-1995-250

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STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY

doi: 10.6052/0459-1879-1997-4-1995-250

北京航空航天大学动力工程系,100083

Publish Date: 1997-07-25

Abstract

Abstract

A micro multiplication moire interferometry method with high spatial resolution and superhigh sensitivity is proposed by combining the traditional moire interferometry with magnification and multiplication techniques. The interference theory is given and the demonstrated experiment is conducted successfully. Then, this new method is applied to the study of the displacement fields and singularity around interlayer crack tip of the simulated microelectronic module under different thermal loadings.
- micro technique,
- multiplication technique,
- reversal technique,
- packaging module,
- singularity