STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY

A micro multiplication moire interferometry method with high spatial resolution and superhigh sensitivity is proposed by combining the traditional moire interferometry with magnification and multiplication techniques. The interference theory is given and the demonstrated experiment is conducted successfully. Then, this new method is applied to the study of the displacement fields and singularity around interlayer crack tip of the simulated microelectronic module under different thermal loadings.