INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD[J]. Chinese Journal of Theoretical and Applied Mechanics, 1995, 27(3): 380-384. DOI: 10.6052/0459-1879-1995-3-1995-445
Citation:
INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD[J]. Chinese Journal of Theoretical and Applied Mechanics, 1995, 27(3): 380-384. DOI: 10.6052/0459-1879-1995-3-1995-445
INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD[J]. Chinese Journal of Theoretical and Applied Mechanics, 1995, 27(3): 380-384. DOI: 10.6052/0459-1879-1995-3-1995-445
Citation:
INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD[J]. Chinese Journal of Theoretical and Applied Mechanics, 1995, 27(3): 380-384. DOI: 10.6052/0459-1879-1995-3-1995-445
INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD
A test method for measuring flexure strength of silicon wafer is investigatedwhich adopts circular wafer sample and impact loading.Combining kinetic energy theoremand small deflection sheet theory,We derive the formula calculating flexure strength.Theaccuracy is satisfactory.
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