基于拓扑优化的自发热体冷却用植入式导热路径设计方法

陈文炯; 刘书田; 张永存

doi:10.6052/0459-1879-15-270

基于拓扑优化的自发热体冷却用植入式导热路径设计方法

大连理工大学, 工业装备结构分析国家重点实验室, 大连 116024

基金项目: 国家自然科学基金(11172052,11332004,11402046),中央高校基本科研业务费(2342013DUT13RC(3)28,DUT16RC(3)010),111计划(B14013),中航产学研项目(CXY2013DLLG32)资助项目.

详细信息

通讯作者:
刘书田,教授,主要研究方向:结构分析与优化.E-mail:stliu@dlut.edu.cn

中图分类号: O343
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出版历程
- 收稿日期: 2015-07-19
- 修回日期: 2015-10-27
- 刊出日期: 2016-03-17

OPTIMIZATION DESIGN OF CONDUCTIVE PATHWAYS FOR COOLING A HEAT GENERATING BODY WITH HIGH CONDUCTIVE INSERTS

State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China

摘要

摘要: 对于具有较低导热系数和较高生热率的热源材料(自发热体),通过优化植入内部的高导热材料的布局以降低内部温度,是实现自发热体冷却的重要措施.如何设计自发热体内部高导热材料的布局,是实现热源内部热量高效收集和温度控制的关键问题.本文研究建立植入式导热路径的拓扑优化设计方法,考虑高导热材料的植入对于热源分布的影响,以实现自发热体冷却的内置导热路径最优设计.基于固体各向同性材料惩罚模型(solid isotropic material with penalization,SIMP)拓扑描述方法,以高导热材料的相对密度为导热路径描述参数,分别选择合适的热传导系数和生热率的插值模型以建立热传导系数和生热率与相对密度的关系,并以结构散热弱度最小为目标,建立了植入式导热路径设计的拓扑优化数学模型和求解方法.该优化模型能够反映高导热材料的布局对热源布局的影响.通过具体算例,给出了贴片式散热路径与植入式散热路径的拓扑优化结果.设计结构表明,两种优化模型获得的最优散热构型存在较大不同,并且考虑植入高导热材料对热源布局影响的设计结果散热性能优于贴片式散热路径的设计结果.数值算例验证了本文所提出方法的正确性和有效性.
- 传导路径 /
- 高导热材料 /
- 拓扑优化 /
- 散热弱度 /
- 热源布局
Abstract: It is an importance to optimize the position of high conductive material in a heat generating body with low thermal conductivity and high heat generation for reducing the internal temperature.A key problem is how to design the structures with high conductive material in the heat generating body for temperature control and heat collection.In this paper, a new method based on topology optimization is proposed to design the conductive pathways with embedded high conductive materials.Based upon SIMP approach, an artificial material model with thermal conductivity and heat generation rate is suggested and the relative densities of the high conductive material are taken as design variables. With the minimum heat potential capacity as the objective, a topology optimization model for designing high conductive inserts is formulated and the corresponding solving method is developed.Two topology optimization configurations of high conductive surfaces and high conductive inserts are given in the numerical examples to show be much different.The capability of heat dissipation for the high conductive inserts is much better than that of the high conductive surfaces.It indicates that it is necessary to consider the impact of the conductive pathways on the layout of heat source.Several numerical examples are given to demonstrate the effectiveness and validity of the proposed optimization method.
- conductive pathways /
- high conductive inserts /
- topology optimization /
- heat potential capacity /
- heat source layout

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