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多物理场下FCBGA焊点电迁移失效预测的数值模拟研究

张元祥 梁利华 张继成 陈俊俊 盛玉峰

张元祥, 梁利华, 张继成, 陈俊俊, 盛玉峰. 多物理场下FCBGA焊点电迁移失效预测的数值模拟研究[J]. 力学学报, 2018, 50(3): 487-496. doi: 10.6052/0459-1879-18-077
引用本文: 张元祥, 梁利华, 张继成, 陈俊俊, 盛玉峰. 多物理场下FCBGA焊点电迁移失效预测的数值模拟研究[J]. 力学学报, 2018, 50(3): 487-496. doi: 10.6052/0459-1879-18-077
Zhang Yuanxiang, Liang Lihua, Zhang Jicheng, Chen Junjun, Sheng Yufeng. MODELING OF ELECTROMIGRATION FAILURE PREDICTING FOR FCBGA SOLDER BUMP UNDER MULTI-PHYSICAL FIELD LOADS[J]. Chinese Journal of Theoretical and Applied Mechanics, 2018, 50(3): 487-496. doi: 10.6052/0459-1879-18-077
Citation: Zhang Yuanxiang, Liang Lihua, Zhang Jicheng, Chen Junjun, Sheng Yufeng. MODELING OF ELECTROMIGRATION FAILURE PREDICTING FOR FCBGA SOLDER BUMP UNDER MULTI-PHYSICAL FIELD LOADS[J]. Chinese Journal of Theoretical and Applied Mechanics, 2018, 50(3): 487-496. doi: 10.6052/0459-1879-18-077

多物理场下FCBGA焊点电迁移失效预测的数值模拟研究

doi: 10.6052/0459-1879-18-077
基金项目: 国家自然科学基金资助项目(51605252, 51375447).
详细信息
    作者简介:

    通讯作者:梁利华, 教授, 主要研究方向:计算固体力学和微电子封装技术研究. E-mail:lianglihua@zjut.edu.cn

    通讯作者:

    梁利华

  • 中图分类号: O346,TN406;

MODELING OF ELECTROMIGRATION FAILURE PREDICTING FOR FCBGA SOLDER BUMP UNDER MULTI-PHYSICAL FIELD LOADS

  • 摘要: 随着微电子封装技术的快速发展, 焊点的电迁移失效问题日益受到关注. 基于有限元法并结合子模型技术对倒装芯片球栅阵列封装(flip chip ball grid array, FCBGA)进行电-热-结构多物理场耦合分析, 详细介绍了封装模型的简化处理方法, 重点分析了易失效关键焊点的电流密度分布、温度分布和应力分布, 发现电子流入口处易产生电流拥挤效应, 而整个焊点的温度梯度较小. 基于综合考虑“电子风力”、温度梯度、应力梯度和原子密度梯度四种电迁移驱动机制的原子密度积分法, 并结合空洞形成/扩散准则及失效判据, 分析FCBGA焊点在不同网格密度下的电迁移空洞演化过程, 发现原子密度积分算法稳定, 不依赖网格密度. 采用原子密度积分法模拟真实 工况下FCBGA关键焊点电迁移空洞形成位置和失效寿命, 重点研究了焊点材料和铜金属层结构对电迁移失效的影响. 结果表明, 电迁移失效寿命随激活能的增加呈指数级增加, 因此Sn3.5Ag焊点的电迁移失效寿命约为63Sn37Pb的2.5倍, 有效电荷数对电迁移寿命也有一定的影响;铜金属层结构的调整会改变电流的流向和焊点的应力分布, 进而影响焊点的电迁移失效寿命.

     

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出版历程
  • 收稿日期:  2018-01-30
  • 刊出日期:  2018-05-18

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