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中文核心期刊

撞击载荷下数字电子散斑离面位移的测试研究1)

A STUDY OF MEASURING OUT OFF PLANE DISPLACEMENT USING DSPI UNDER IMPACT LOADING

  • 摘要: 采用瞬态光学图像采集技术,实现了动态数字散斑干涉(DSPI).以周边固支圆板受法向撞击集中载荷为例,对其离面位移场进行了测试.实验值与动有限元计算结果比较,两者是比较接近的

     

    Abstract: The dynamic digital speckle pattern interferometry(DSPI) has been achieved by using the instantaneous image capturing technique. The measurement of out of plane displacement field of circular restrained plate with a cross point impact loading is completed. The results of dynamic finite element method show good agreement with those of experiments.

     

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