圆片冲击法测定硅片抗弯强度的研究
INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD
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摘要: 提出了一种新的使用圆片试样及冲击加载的硅片抗弯强度测试方法，结合动能定理和薄板小挠度理论推导了抗弯强度的计算公式，测试结果准确，精度好。Abstract: A test method for measuring flexure strength of silicon wafer is investigatedwhich adopts circular wafer sample and impact loading.Combining kinetic energy theoremand small deflection sheet theory,We derive the formula calculating flexure strength.Theaccuracy is satisfactory.
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