利用维氏和玻氏压头表征半导体材料断裂韧性1)
STUDY ON FRACTURE TOUGHNESS OF SEMICONDUCTOR MATERIAL USING VICKERS AND BERKOVICH INDENTERS1)
利用维氏和玻氏压头表征半导体材料断裂韧性1) |
| 刘明, 侯冬杨, 高诚辉 |
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STUDY ON FRACTURE TOUGHNESS OF SEMICONDUCTOR MATERIAL USING VICKERS AND BERKOVICH INDENTERS1) |
| Liu Ming, Hou Dongyang, Gao Chenghui |
| 图4 样品的$c/a$值及巴氏和中位裂纹模型 |
| Fig.4 $c/a$ of samples and model of Palmqvist and Median crack |
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