利用维氏和玻氏压头表征半导体材料断裂韧性1)
STUDY ON FRACTURE TOUGHNESS OF SEMICONDUCTOR MATERIAL USING VICKERS AND BERKOVICH INDENTERS1)
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利用维氏和玻氏压头表征半导体材料断裂韧性1) |
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| 刘明, 侯冬杨, 高诚辉 | |
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STUDY ON FRACTURE TOUGHNESS OF SEMICONDUCTOR MATERIAL USING VICKERS AND BERKOVICH INDENTERS1) |
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| Liu Ming, Hou Dongyang, Gao Chenghui | |
| 表2 样品参数和维氏压痕尺寸 |
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| Table 2 Parameters of samples and Vickers indentation |
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