Mindlin 矩形微板的热弹性阻尼解析解 <sup>1)</sup>

Mindlin 矩形微板的热弹性阻尼解析解 ¹⁾

马航空,周晨阳,李世荣

ANLYTICAL SOLUTION OF THERMOELASTIC DAMPING IN RECTANGULAR MINDLIN MICRO PLATES ¹⁾

Ma Hangkong,Zhou Chenyang,Li Shirong

表1 微板的材料性质 ($T_0 = 300$ K)^{[23, 25]}

Table 1 Material properties of the micro plate ($T_0 = 300$ K)^{[23, 25]}