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冯世亮,周吕文,吕守芹,龙勉

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Feng Shiliang,Zhou Lüwen,Lü Shouqin,Long Mian
图5 $R_{h}= 0.1$ (a) 或 0.3 (b) 时不同接触长度下的E-cad*稳态分布图. (b) 中的插图显示E-cad*峰值浓度随接触区长度呈双相性变化
Fig.5 Profiles of E-cad* at $R_{h} = 0.1$ (a) and 0.3 (b) upon different extrusion deformations. Inserted panel in (b) shows the dependence of maximum E-cad* concentration with the contact length。