多物理场下FCBGA焊点电迁移失效预测的数值模拟研究

张元祥, 梁利华, 张继成, 陈俊俊, 盛玉峰

MODELING OF ELECTROMIGRATION FAILURE PREDICTING FOR FCBGA SOLDER BUMP UNDER MULTI-PHYSICAL FIELD LOADS

Zhang Yuanxiang, Liang Lihua, Zhang Jicheng, Chen Junjun, Sheng Yufeng

表 3 不同网格密度下焊点的失效寿命和误差

Table 3 TTF and deviation under different meshes