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STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY[J]. Chinese Journal of Theoretical and Applied Mechanics, 1997, 29(4): 448-455. DOI: 10.6052/0459-1879-1997-4-1995-250
Citation: STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY[J]. Chinese Journal of Theoretical and Applied Mechanics, 1997, 29(4): 448-455. DOI: 10.6052/0459-1879-1997-4-1995-250
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STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY

  • 北京航空航天大学动力工程系,100083

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  • A micro multiplication moire interferometry method with high spatial resolution and superhigh sensitivity is proposed by combining the traditional moire interferometry with magnification and multiplication techniques. The interference theory is given and the demonstrated experiment is conducted successfully. Then, this new method is applied to the study of the displacement fields and singularity around interlayer crack tip of the simulated microelectronic module under different thermal loadings.
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