Chinese Journal of Theoretical and Applied Mechani ›› 1997, Vol. 29 ›› Issue (4): 448-455.DOI: 10.6052/0459-1879-1997-4-1995-250

• Research paper • Previous Articles     Next Articles

STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY

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  1. 北京航空航天大学动力工程系,100083
  • Received:1900-01-01 Revised:1900-01-01 Online:1997-07-25 Published:1997-07-25

Abstract: A micro multiplication moire interferometry method with high spatial resolution and superhigh sensitivity is proposed by combining the traditional moire interferometry with magnification and multiplication techniques. The interference theory is given and the demonstrated experiment is conducted successfully. Then, this new method is applied to the study of the displacement fields and singularity around interlayer crack tip of the simulated microelectronic module under different thermal loadings.

Key words: micro technique, multiplication technique, reversal technique, packaging module, singularity