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刘冬欢 郑小平 刘应华. 不连续温度场问题的间断Galerkin方法[J]. 力学学报, 2010, 42(1): 74-82. DOI: 10.6052/0459-1879-2010-1-2009-003
引用本文: 刘冬欢 郑小平 刘应华. 不连续温度场问题的间断Galerkin方法[J]. 力学学报, 2010, 42(1): 74-82. DOI: 10.6052/0459-1879-2010-1-2009-003
Donghuan Liu, Xiaoping Zheng, Yinghua Liu. discontinuous galerkin method for discontinuous temperature field problems[J]. Chinese Journal of Theoretical and Applied Mechanics, 2010, 42(1): 74-82. DOI: 10.6052/0459-1879-2010-1-2009-003
Citation: Donghuan Liu, Xiaoping Zheng, Yinghua Liu. discontinuous galerkin method for discontinuous temperature field problems[J]. Chinese Journal of Theoretical and Applied Mechanics, 2010, 42(1): 74-82. DOI: 10.6052/0459-1879-2010-1-2009-003

不连续温度场问题的间断Galerkin方法

discontinuous galerkin method for discontinuous temperature field problems

  • 摘要: 针对不连续温度场问题建立了一种间断Galerkin有限元方法,该方法的主要特点是允许插值函数在单元边界上存在跳变. 在建立有限元方程时,通过在单元边界上引入数值通量项和稳定性项来处理间断效应,并且数值通量可以直接由接触热阻的定义式导出. 数值算例表明该方法可以很方便且准确地捕捉到结构内部由于接触热阻而引起的温度跳变,同时在局部高梯度温度场的模拟方面也比常规连续Galerkin有限元方法效率明显要高. 该方法也为研究由接触热阻引起的温度场与应力场之间的耦合问题提供了一种新的数值模拟手段.

     

    Abstract: A discontinuous Galerkin (DG) finite element method forthe discontinuous temperature field problems is presented. The DG methoduses discontinuous interpolation functions on the element boundaries, andthe discontinuous effect is considered by the penalty function techniques,in which the numerical flux and the stabilization term are adopted at theinterface. By substituting the numerical flux at the imperfect contactinterface with the definition of the thermal contact resistance, andeliminating the stabilization term, the present DG method can easily andaccurately capture the temperature jump caused by thermal contactresistance. Compared with the continuous Galerkin method, the present DGmethod also has higher computational efficiency in capturing the peak valueof the heat flux of the local high gradient temperature field. Numericalexamples also show that the present DG method is a novel numerical methodfor solving the coupling problems between the temperature and stress fieldcaused by thermal contact resistance.

     

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